3D Stack Memory TSOP & BGA Packaging Reliability

dc.contributor.author	Ghaffarian, Reza
dc.date.accessioned	2022-03-09T16:30:15Z
dc.date.available	2022-03-09T16:30:15Z
dc.date.issued	2021-02-09
dc.identifier.citation	Microelectronics Reliability and Qualification Workshop (MRQW) 2021, El Segundo, California, February 9-11, 2021
dc.identifier.clearanceno	CL#21-0318
dc.identifier.uri	http://hdl.handle.net/2014/54402
dc.description.sponsorship	NASA/JPL	en_US
dc.language.iso	en_US
dc.publisher	Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2021
dc.title	3D Stack Memory TSOP & BGA Packaging Reliability
dc.type	Presentation