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3D Stack Memory TSOP & BGA Packaging Reliability

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dc.contributor.author Ghaffarian, Reza
dc.date.accessioned 2022-03-09T16:30:15Z
dc.date.available 2022-03-09T16:30:15Z
dc.date.issued 2021-02-09
dc.identifier.citation Microelectronics Reliability and Qualification Workshop (MRQW) 2021, El Segundo, California, February 9-11, 2021
dc.identifier.clearanceno CL#21-0318
dc.identifier.uri http://hdl.handle.net/2014/54402
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US
dc.publisher Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2021
dc.title 3D Stack Memory TSOP & BGA Packaging Reliability
dc.type Presentation


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