Adapting New Electronic Component Technology on NASA Missions

dc.contributor.author	Agarwal, Shri G.
dc.contributor.author	Sampson, Michael J.
dc.date.accessioned	2021-05-03T19:02:32Z
dc.date.available	2021-05-03T19:02:32Z
dc.date.issued	2019-10-23
dc.identifier.citation	The 32nd Microelectronic Workshop (MEWS32), Tsukuba, Japan, October 23-24, 2019	en_US
dc.identifier.clearanceno	19-6438
dc.identifier.uri	http://hdl.handle.net/2014/51878
dc.description.sponsorship	NASA/JPL	en_US
dc.language.iso	en_US	en_US
dc.publisher	Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2019	en_US
dc.title	Adapting New Electronic Component Technology on NASA Missions	en_US
dc.type	Presentation	en_US