2D, 2.1D, 2.5D, and 3D Package Studies in NEPP

dc.contributor.author	Suh, Eric J.
dc.contributor.author	Riendeau, Joseph
dc.date.accessioned	2021-03-19T23:05:47Z
dc.date.available	2021-03-19T23:05:47Z
dc.date.issued	2019-06-17
dc.identifier.citation	2019 NEPP Electronics Technology Workshop, Greenbelt, Maryland, June 17-20, 2019	en_US
dc.identifier.clearanceno	19-4814
dc.identifier.uri	http://hdl.handle.net/2014/51572
dc.description.sponsorship	NASA/JPL	en_US
dc.language.iso	en_US	en_US
dc.publisher	Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2019	en_US
dc.title	2D, 2.1D, 2.5D, and 3D Package Studies in NEPP	en_US
dc.type	Presentation	en_US