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2D, 2.1D, 2.5D, and 3D Package Studies in NEPP

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dc.contributor.author Suh, Eric J.
dc.contributor.author Riendeau, Joseph
dc.date.accessioned 2021-03-19T23:05:47Z
dc.date.available 2021-03-19T23:05:47Z
dc.date.issued 2019-06-17
dc.identifier.citation 2019 NEPP Electronics Technology Workshop, Greenbelt, Maryland, June 17-20, 2019 en_US
dc.identifier.clearanceno 19-4814
dc.identifier.uri http://hdl.handle.net/2014/51572
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2019 en_US
dc.title 2D, 2.1D, 2.5D, and 3D Package Studies in NEPP en_US
dc.type Presentation en_US


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