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Cold Survivable Current Sense Multi-Chip Module

Show simple item record Lias, Malcolm L Bolotin, Gary Hunter, Don Cheng, Ben 2021-03-02T17:21:46Z 2021-03-02T17:21:46Z 2020-03-07
dc.identifier.citation 2020 IEEE Aerospace Conference, Big Sky, Montana, March 7-14, 2020
dc.identifier.clearanceno CL#19-7648
dc.description.abstract This paper will present the design of a Current Sense Module (CSM) used to measure motor phase currents that is capable of surviving the harsh ambient environment of ocean worlds, such as Europa and Enceladus. The CSM module is fabricated by i3 Electronics using their Multi-Chip Module (MCM) technology with techniques developed by JPL to allow this module to survive temperatures down to -184°C. This module greatly improves the ability to measure phase and bridge current which can be problematic in extreme environments. In addition, by packaging these electronics at the die level, we achieve significant weight and size savings. This module is one of several modules that employ similar techniques that are integrated into a distributed or centralized motor controller. This paper will discuss the module’s design along with a summary of our test results.
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US
dc.publisher Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2020
dc.title Cold Survivable Current Sense Multi-Chip Module
dc.type Preprint

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