JPL Technical Report Server

Thermally-resilient image sensor packaging approach for Mars2020 enhanced engineering cameras

Show simple item record

dc.contributor.author McKinney, Colin
dc.contributor.author Goodsall, Timothy
dc.contributor.author Ghaffarian, Reza
dc.contributor.author Blank, Richard
dc.contributor.author Blakely, Michael
dc.contributor.author Choubey, Anupam
dc.contributor.author Howard, Sean
dc.date.accessioned 2020-10-30T19:27:43Z
dc.date.available 2020-10-30T19:27:43Z
dc.date.issued 2019-03-02
dc.identifier.citation IEEE Aerospace Conference 2019, Big Sky, Montana, March 2-9, 2019 en_US
dc.identifier.clearanceno 19-0215
dc.identifier.uri http://hdl.handle.net/2014/50389
dc.description.abstract We will present the steps taken to derive the thermally-resilient electronics packaging design of the Mars2020 EECAM detector. We will highlight analyses and empirical test results that lead to a wide-temperature-survivable COTS component packaging design. Details of thermal cycle testing, in-process inspections, and final packaging design will be presented. en_US
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2019 en_US
dc.title Thermally-resilient image sensor packaging approach for Mars2020 enhanced engineering cameras en_US
dc.type Preprint en_US


Files in this item

This item appears in the following Collection(s)

Show simple item record

Search


Browse

My Account