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Interconnect and packaging technologies for terahertz frequencies

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dc.contributor.author Chattopadhyay, Goutam
dc.contributor.author Reck, Theodore
dc.contributor.author Jung-Kubiak, Cecile
dc.contributor.author Alonso-delPino, Maria
dc.contributor.author Lee, Choonsup
dc.date.accessioned 2019-06-12T18:54:00Z
dc.date.available 2019-06-12T18:54:00Z
dc.date.issued 2017-03-19
dc.identifier.citation EuCAP 2017, Paris, France, March 19-24, 2017 en_US
dc.identifier.clearanceno 16-4956
dc.identifier.uri http://hdl.handle.net/2014/46255
dc.description.abstract Using newly developed silicon micromachining technology that enables low-loss and highly integrated packaging solutions, we are developing vertically stacked transmitters and receivers at terahertz frequencies that can be used for communication and other terahertz systems. Although there are multiple ways to address the problem of interconnect and packaging solutions at these frequencies, such as system-on-package (SOP), multi-chip modules (MCM), substrate integrated waveguide (SIW), liquid crystal polymer (LCP) based multilayer technologies, and others, we show that deep reactive ion etching (DRIE) based silicon micromachining with vertical integration allows the most effective solutions at terahertz frequencies. en_US
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2017 en_US
dc.subject Terahertz en_US
dc.subject Micromachining en_US
dc.subject DRIE en_US
dc.subject interconnects en_US
dc.subject packaging en_US
dc.title Interconnect and packaging technologies for terahertz frequencies en_US
dc.type Preprint en_US


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