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Silicon micromachining for terahertz component development

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dc.contributor.author Chattopadhyay, Goutam
dc.contributor.author Reck, Theodore J.
dc.contributor.author Jung-Kubiak, Cecile
dc.contributor.author Siles, Jose V.
dc.contributor.author Lee, Choonsup
dc.contributor.author Lin, Robert
dc.contributor.author Mehdi, Imran
dc.date.accessioned 2014-03-06T22:49:20Z
dc.date.available 2014-03-06T22:49:20Z
dc.date.issued 2013-12-14
dc.identifier.citation 2013 IEEE MTT-S International Microwave and RF Conference, New Delhi, India, December 14- 16, 2013 en_US
dc.identifier.clearanceno CL#13-3353
dc.identifier.uri http://hdl.handle.net/2014/44415
dc.description.abstract Waveguide component technology at terahertz frequencies has come of age in recent years. Essential components such as ortho-mode transducers (OMT), quadrature hybrids, filters, and others for high performance system development were either impossible to build or too difficult to fabricate with traditional machining techniques. With micromachining of silicon wafers coated with sputtered gold it is now possible to fabricate and test these waveguide components. Using a highly optimized Deep Reactive Ion Etching (DRIE) process, we are now able to fabricate silicon micromachined waveguide structures working beyond 1 THz. In this paper, we describe in detail our approach of design, fabrication, and measurement of silicon micromachined waveguide components and report the results of a 1 THz canonical E-plane filter. en_US
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2013 en_US
dc.subject Filter en_US
dc.subject communications en_US
dc.subject imaging en_US
dc.subject cancer en_US
dc.title Silicon micromachining for terahertz component development en_US
dc.type Preprint en_US


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