Broad frequency LTCC vertical interconnect transition for multichip modules and system on package applications

Decrossas, Emmanuel; Glover, Michael D.; Porter, Kaoru; Cannon, Tom; Mantooth, H. Alan; Hamilton, M. C.

dc.contributor.author	Decrossas, Emmanuel
dc.contributor.author	Glover, Michael D.
dc.contributor.author	Porter, Kaoru
dc.contributor.author	Cannon, Tom
dc.contributor.author	Mantooth, H. Alan
dc.contributor.author	Hamilton, M. C.
dc.date.accessioned	2013-12-17T21:03:52Z
dc.date.available	2013-12-17T21:03:52Z
dc.date.issued	2013-10-06
dc.identifier.citation	European Microwave Week 2013, Nuremberg, Germany, October 6-11, 2013	en_US
dc.identifier.clearanceno	13-0976
dc.identifier.uri	http://hdl.handle.net/2014/44099
dc.description.abstract	Various stripline structures and flip chip interconnect designs for high-speed digital communication systems implemented in low temperature co-fired ceramic (LTCC) substrates are studied in this paper. Specifically, two different transition designs from edge launch 2.4mm connectors to stripline transmission lines embedded in LTCC are discussed. After characterizing the DuPontTM 9K7 green tape, different designs are proposed to improve signal integrity for high-speed digital data. The full-wave simulations and experimental data validate the presented designs over a broad frequency band from DC to 50 GHz and beyond.	en_US
dc.description.sponsorship	NASA/JPL	en_US
dc.language.iso	en_US	en_US
dc.publisher	Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2013	en_US
dc.subject	Full-tape-thickness feature; LTCC 9K7 interconnect; multi-chip-module	en_US
dc.subject	quasi-coaxial vertical transition	en_US
dc.subject	signal integrity	en_US
dc.subject	system on package (SOP)	en_US
dc.title	Broad frequency LTCC vertical interconnect transition for multichip modules and system on package applications	en_US
dc.type	Preprint	en_US