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Broad frequency LTCC vertical interconnect transition for multichip modules and system on package applications

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dc.contributor.author Decrossas, Emmanuel
dc.contributor.author Glover, Michael D.
dc.contributor.author Porter, Kaoru
dc.contributor.author Cannon, Tom
dc.contributor.author Mantooth, H. Alan
dc.contributor.author Hamilton, M. C.
dc.date.accessioned 2013-12-17T21:03:52Z
dc.date.available 2013-12-17T21:03:52Z
dc.date.issued 2013-10-06
dc.identifier.citation European Microwave Week 2013, Nuremberg, Germany, October 6-11, 2013 en_US
dc.identifier.clearanceno 13-0976
dc.identifier.uri http://hdl.handle.net/2014/44099
dc.description.abstract Various stripline structures and flip chip interconnect designs for high-speed digital communication systems implemented in low temperature co-fired ceramic (LTCC) substrates are studied in this paper. Specifically, two different transition designs from edge launch 2.4mm connectors to stripline transmission lines embedded in LTCC are discussed. After characterizing the DuPontTM 9K7 green tape, different designs are proposed to improve signal integrity for high-speed digital data. The full-wave simulations and experimental data validate the presented designs over a broad frequency band from DC to 50 GHz and beyond. en_US
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2013 en_US
dc.subject Full-tape-thickness feature; LTCC 9K7 interconnect; multi-chip-module en_US
dc.subject quasi-coaxial vertical transition en_US
dc.subject signal integrity en_US
dc.subject system on package (SOP) en_US
dc.title Broad frequency LTCC vertical interconnect transition for multichip modules and system on package applications en_US
dc.type Preprint en_US


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