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Physics of failure analysis of Xilinx Flip chip CCGA packages.
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Physics of failure analysis of Xilinx Flip chip CCGA packages.
Suh, Jong-ook
;
Agarwal, Shri
;
Dillon, Peter
;
Sheldon, Doug
URI:
http://hdl.handle.net/2014/42399
Date:
2012-06-11
Keywords:
non‐hermetic flip chip; reliability testing; failure analysis
Publisher:
Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012.
Citation:
3rd Annual NEPP Electronic Technology Workshop (ETW), Greenbelt, Maryland, June 11-13, 2012.
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JPL TRS 1992+
JPL TRS 1992+
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