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Physics of failure analysis of Xilinx Flip chip CCGA packages.

Physics of failure analysis of Xilinx Flip chip CCGA packages.

Suh, Jong-ook; Agarwal, Shri; Dillon, Peter; Sheldon, Doug
URI: http://hdl.handle.net/2014/42399
Date: 2012-06-11
Keywords: non‐hermetic flip chip; reliability testing; failure analysis
Publisher: Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012.
Citation: 3rd Annual NEPP Electronic Technology Workshop (ETW), Greenbelt, Maryland, June 11-13, 2012.

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