Lead-free vs tin-lead reliability of advanced electronic assemblies

Ghaffarian, Reza

Lead-free vs tin-lead reliability of advanced electronic assemblies

Ghaffarian, Reza

URI: http://hdl.handle.net/2014/40172

Date: 2005-12-06

Keywords: assembly reliability; solder; board assembly

Publisher: Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2005.

Citation: Microelectronic Reliability on Quality Workshop, Manhattan Beach, California, December 6-7, 2005.

Abstract:

This presentation will provide the technical background and specific information published in literature related to reliability test, analyses, modeling, and associated issues for lead-free solder package assemblies in comparison to their tin-lead solder alloys. It also presents current understanding of lead-free thermal cycle test performance in support

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