dc.contributor.author |
Decker, D. |
en_US |
dc.contributor.author |
Olson, H. |
en_US |
dc.contributor.author |
Tatikola, R. |
en_US |
dc.contributor.author |
Neuman, S. |
en_US |
dc.contributor.author |
Gutierrez, R. |
en_US |
dc.contributor.author |
Mysoor, N. |
en_US |
dc.date.accessioned |
2004-10-06 |
|
dc.date.available |
2004-10-06 |
|
dc.date.issued |
1994-05-22 |
en_US |
dc.identifier.citation |
IEEE, International Microwave Interconnect and Packaging Technology Symposium |
en_US |
dc.identifier.citation |
San Diego, California, USA |
en_US |
dc.identifier.clearanceno |
94-0819 |
en_US |
dc.identifier.uri |
http://hdl.handle.net/2014/34470 |
|
dc.description.abstract |
This package provides space for mounting up to five MMIC chips and has three RF and five DC feed-throughs. |
en_US |
dc.format.extent |
558245 bytes |
|
dc.format.mimetype |
application/pdf |
|
dc.language.iso |
en_US |
|
dc.subject.other |
Multichip MMIC package RF feed-throughs conductor backed coplanar waveguide |
en_US |
dc.title |
Multichip MMIC Package for X and Ka-bands |
en_US |