Multichip MMIC Package for X and Ka-bands

Decker, D.; Olson, H.; Tatikola, R.; Neuman, S.; Gutierrez, R.; Mysoor, N.

dc.contributor.author	Decker, D.	en_US
dc.contributor.author	Olson, H.	en_US
dc.contributor.author	Tatikola, R.	en_US
dc.contributor.author	Neuman, S.	en_US
dc.contributor.author	Gutierrez, R.	en_US
dc.contributor.author	Mysoor, N.	en_US
dc.date.accessioned	2004-10-06
dc.date.available	2004-10-06
dc.date.issued	1994-05-22	en_US
dc.identifier.citation	IEEE, International Microwave Interconnect and Packaging Technology Symposium	en_US
dc.identifier.citation	San Diego, California, USA	en_US
dc.identifier.clearanceno	94-0819	en_US
dc.identifier.uri	http://hdl.handle.net/2014/34470
dc.description.abstract	This package provides space for mounting up to five MMIC chips and has three RF and five DC feed-throughs.	en_US
dc.format.extent	558245 bytes
dc.format.mimetype	application/pdf
dc.language.iso	en_US
dc.subject.other	Multichip MMIC package RF feed-throughs conductor backed coplanar waveguide	en_US
dc.title	Multichip MMIC Package for X and Ka-bands	en_US