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Multichip MMIC Package for X and Ka-bands

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dc.contributor.author Decker, D. en_US
dc.contributor.author Olson, H. en_US
dc.contributor.author Tatikola, R. en_US
dc.contributor.author Neuman, S. en_US
dc.contributor.author Gutierrez, R. en_US
dc.contributor.author Mysoor, N. en_US
dc.date.accessioned 2004-10-06
dc.date.available 2004-10-06
dc.date.issued 1994-05-22 en_US
dc.identifier.citation IEEE, International Microwave Interconnect and Packaging Technology Symposium en_US
dc.identifier.citation San Diego, California, USA en_US
dc.identifier.clearanceno 94-0819 en_US
dc.identifier.uri http://hdl.handle.net/2014/34470
dc.description.abstract This package provides space for mounting up to five MMIC chips and has three RF and five DC feed-throughs. en_US
dc.format.extent 558245 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other Multichip MMIC package RF feed-throughs conductor backed coplanar waveguide en_US
dc.title Multichip MMIC Package for X and Ka-bands en_US


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