dc.contributor.author | Winslow, J. | en_US |
dc.date.accessioned | 2004-10-05T22:17:59Z | |
dc.date.available | 2004-10-05T22:17:59Z | |
dc.date.issued | 1995-03-26 | en_US |
dc.identifier.citation | Lahaina, Hawaii, USA | en_US |
dc.identifier.clearanceno | 94-0696 | en_US |
dc.identifier.uri | http://hdl.handle.net/2014/33961 | |
dc.format.extent | 106307 bytes | |
dc.format.mimetype | application/pdf | |
dc.language.iso | en_US | |
dc.subject.other | electronic component packages quadpak leadless chip carriers LCC j-leaded components | en_US |
dc.title | Some Observations on the Role of Component Size in Solder Joint Degradation under Thermal Cycling Environments | en_US |