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Some Observations on the Role of Component Size in Solder Joint Degradation under Thermal Cycling Environments

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dc.contributor.author Winslow, J. en_US
dc.date.accessioned 2004-10-05T22:17:59Z
dc.date.available 2004-10-05T22:17:59Z
dc.date.issued 1995-03-26 en_US
dc.identifier.citation Lahaina, Hawaii, USA en_US
dc.identifier.clearanceno 94-0696 en_US
dc.identifier.uri http://hdl.handle.net/2014/33961
dc.format.extent 106307 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other electronic component packages quadpak leadless chip carriers LCC j-leaded components en_US
dc.title Some Observations on the Role of Component Size in Solder Joint Degradation under Thermal Cycling Environments en_US


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