Some Observations on the Role of Component Size in Solder Joint Degradation under Thermal Cycling Environments

dc.contributor.author	Winslow, J.	en_US
dc.date.accessioned	2004-10-05T22:17:59Z
dc.date.available	2004-10-05T22:17:59Z
dc.date.issued	1995-03-26	en_US
dc.identifier.citation	Lahaina, Hawaii, USA	en_US
dc.identifier.clearanceno	94-0696	en_US
dc.identifier.uri	http://hdl.handle.net/2014/33961
dc.format.extent	106307 bytes
dc.format.mimetype	application/pdf
dc.language.iso	en_US
dc.subject.other	electronic component packages quadpak leadless chip carriers LCC j-leaded components	en_US
dc.title	Some Observations on the Role of Component Size in Solder Joint Degradation under Thermal Cycling Environments	en_US