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Thermo-Mechanical Stress and Fatigue Life Prediction of Microelectronics Interconnects

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dc.contributor.author Larson, Timothy W. en_US
dc.date.accessioned 2004-10-04T19:57:44Z
dc.date.available 2004-10-04T19:57:44Z
dc.date.issued 1995-11 en_US
dc.identifier.citation Orlando, Florida en_US
dc.identifier.clearanceno 95-1388 en_US
dc.identifier.uri http://hdl.handle.net/2014/31942
dc.format.extent 68873 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other Microelectronics Interconnects en_US
dc.title Thermo-Mechanical Stress and Fatigue Life Prediction of Microelectronics Interconnects en_US


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