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Qualification of Ball Grid Array Assemblies for Space Flight Applications

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dc.contributor.author Bonner, K. en_US
dc.contributor.author Walton, S. en_US
dc.date.accessioned 2004-10-01T05:24:34Z
dc.date.available 2004-10-01T05:24:34Z
dc.date.issued 1997-02-09 en_US
dc.identifier.citation Orlando, Florida, USA en_US
dc.identifier.clearanceno 96-1491 en_US
dc.identifier.uri http://hdl.handle.net/2014/27395
dc.description.abstract None given. From Background section: JPL, in partnership with an industrial consortium, is engaged in the investigation of reliability and quality issues of ball grid array (BGA) packages for space flight electronics applications. en_US
dc.format.extent 355182 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other BGA ball grid arrays en_US
dc.title Qualification of Ball Grid Array Assemblies for Space Flight Applications en_US


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