JPL Technical Report Server

Reliability Modeling of MCMs - RELTECH Lessons Learned

Show simple item record

dc.contributor.author Newell, James M. en_US
dc.contributor.author Larson, Timothy W. en_US
dc.contributor.author Gersch, Glenn en_US
dc.contributor.author Stoklosa, Mark en_US
dc.date.accessioned 2004-09-30T03:31:17Z
dc.date.available 2004-09-30T03:31:17Z
dc.date.issued 1996-04-17 en_US
dc.identifier.citation Denver, Colorado, USA en_US
dc.identifier.clearanceno 96-0323 en_US
dc.identifier.uri http://hdl.handle.net/2014/24305
dc.description.abstract The rapid development of advanced electronic packaging and interconnect technologiew, specifically MCMs, requires effective ways of evaluating the reliability of these packages... en_US
dc.format.extent 521402 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other MCM packaging reliability modeling analysis thermo-mechanical en_US
dc.title Reliability Modeling of MCMs - RELTECH Lessons Learned en_US


Files in this item

This item appears in the following Collection(s)

Show simple item record

Search


Browse

My Account