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CSP/BGA Board level Reliability

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dc.contributor.author Ghaffarian, R. en_US
dc.date.accessioned 2004-09-27T17:39:45Z
dc.date.available 2004-09-27T17:39:45Z
dc.date.issued 1998-03-01 en_US
dc.identifier.citation Anaheim, California, USA en_US
dc.identifier.clearanceno 97-1542 en_US
dc.identifier.uri http://hdl.handle.net/2014/22990
dc.description.abstract Different aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included the assembly reliability of conventional Surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages. en_US
dc.format.extent 399309 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other package type board material surface finish solder volume environmental condition en_US
dc.title CSP/BGA Board level Reliability en_US


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