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Thermoelectric Microcoolers for Thermal Management Applications

Thermoelectric Microcoolers for Thermal Management Applications

Fleurial, J. P.; Borshchevsky, A.; Ryan, M. A.; Phillips, W.; Kolawa, E.; Ewell, R.
URI: http://hdl.handle.net/2014/22653
Date: 1997-08-02
Citation: Dresden, Germany

Abstract:

Due to the combined increase in circuit integration and chip power dissipation, there is a rapidly growing demand for solving the thermal management issues of power microelectronics.

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