JPL Technical Report Server

A Review of Chip Scale Package Assembled Reliability

Show simple item record Ghaffarian, Reza en_US 2004-09-25T23:39:13Z 2004-09-25T23:39:13Z 1997-02-20 en_US
dc.identifier.citation Sunnyvale, California, USA en_US
dc.identifier.clearanceno 97-0010 en_US
dc.description.abstract NASA Headquarters, code Q, has established the Advanced Interconnect Program (AIP) to address the NASA's Common needs in electronic packaging for microspacecraft applications. The Jet Propulsion Laboratory was funded to address the quality and reliability of several high denstiy electronic packaging technologies. en_US
dc.format.extent 727786 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other Chip Scale Packaging Microspacecraft en_US
dc.title A Review of Chip Scale Package Assembled Reliability en_US

Files in this item

This item appears in the following Collection(s)

Show simple item record



My Account