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Reliability and Failure Analyses of Thermally Cycled Ball Grid Array Assemblies

Reliability and Failure Analyses of Thermally Cycled Ball Grid Array Assemblies

Ghaffarian, R.; Kim, N. P.
URI: http://hdl.handle.net/2014/18957
Date: 1998-05-25
Citation: Electronic Components and Technology Conference
Seattle, WA, U.S.A.

Abstract:

Reliability of Ball Grid Arrays was assessed as part of a consortium effort led by the Jet Propulsion Laboratory.

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