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Methodology and Results of Upscreening Electronic Parts in Plastic Packages

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dc.contributor.author Sandor, M. en_US
dc.contributor.author Agarwal, S. en_US
dc.contributor.author Villegas, E. en_US
dc.date.accessioned 2004-09-23T23:36:30Z
dc.date.available 2004-09-23T23:36:30Z
dc.date.issued 1999-05-12 en_US
dc.identifier.citation JPL Electronic Packaging for Space Application Workshop en_US
dc.identifier.citation Pasadena, CA, U.S.A. en_US
dc.identifier.clearanceno 99-0634
dc.identifier.uri http://hdl.handle.net/2014/17205
dc.format.extent 1971881 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other Upscreening Electronic Parts Plastic Packages en_US
dc.title Methodology and Results of Upscreening Electronic Parts in Plastic Packages en_US


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