A new wafer-level membrane transfer technique for MEMS deformable mirrors

dc.contributor.author	Yang, E. H.	en_US
dc.contributor.author	Wiberg, D. V.	en_US
dc.date.accessioned	2004-09-23T21:19:08Z
dc.date.available	2004-09-23T21:19:08Z
dc.date.issued	2001-01-21	en_US
dc.identifier.citation	14th IEEE International Micro Electro Mechanical Systems Conference	en_US
dc.identifier.citation	USA	en_US
dc.identifier.clearanceno	00-1797	en_US
dc.identifier.uri	http://hdl.handle.net/2014/15972
dc.format.extent	811334 bytes
dc.format.mimetype	application/pdf
dc.language.iso	en_US
dc.subject.other	membrane transfer wafer-level transfer indium-bonding hermetic sealing deformable mirror single crystal silicon	en_US
dc.title	A new wafer-level membrane transfer technique for MEMS deformable mirrors	en_US