dc.contributor.author | Yang, E. H. | en_US |
dc.contributor.author | Wiberg, D. V. | en_US |
dc.date.accessioned | 2004-09-23T21:19:08Z | |
dc.date.available | 2004-09-23T21:19:08Z | |
dc.date.issued | 2001-01-21 | en_US |
dc.identifier.citation | 14th IEEE International Micro Electro Mechanical Systems Conference | en_US |
dc.identifier.citation | USA | en_US |
dc.identifier.clearanceno | 00-1797 | en_US |
dc.identifier.uri | http://hdl.handle.net/2014/15972 | |
dc.format.extent | 811334 bytes | |
dc.format.mimetype | application/pdf | |
dc.language.iso | en_US | |
dc.subject.other | membrane transfer wafer-level transfer indium-bonding hermetic sealing deformable mirror single crystal silicon | en_US |
dc.title | A new wafer-level membrane transfer technique for MEMS deformable mirrors | en_US |