Extreme thermal environmental tests of plastic encapsulated cots

Kim, Q.; Okuno,  J. O.; Evans,  K. C.; Knudson,  D.; Mih,  D. T.; Gerke,  R. D.; Sandor,  M. A.

dc.contributor.author	Kim, Q.	en_US
dc.contributor.author	Okuno, J. O.	en_US
dc.contributor.author	Evans, K. C.	en_US
dc.contributor.author	Knudson, D.	en_US
dc.contributor.author	Mih, D. T.	en_US
dc.contributor.author	Gerke, R. D.	en_US
dc.contributor.author	Sandor, M. A.	en_US
dc.date.accessioned	2004-09-23T21:15:48Z
dc.date.available	2004-09-23T21:15:48Z
dc.date.issued	2000-08-17	en_US
dc.identifier.citation	3rd Annual IEEE Microelctronics Reliability and Qualification Workshop	en_US
dc.identifier.citation	Glendale, California, USA	en_US
dc.identifier.clearanceno	00-1732	en_US
dc.identifier.uri	http://hdl.handle.net/2014/15929
dc.format.extent	49017 bytes
dc.format.mimetype	application/pdf
dc.language.iso	en_US
dc.subject.other	thermal cycle tests plastic encapsulated microelectronics space qualification methodology	en_US
dc.title	Extreme thermal environmental tests of plastic encapsulated cots	en_US