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Extreme thermal environmental tests of plastic encapsulated cots

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dc.contributor.author Kim, Q. en_US
dc.contributor.author Okuno, J. O. en_US
dc.contributor.author Evans, K. C. en_US
dc.contributor.author Knudson, D. en_US
dc.contributor.author Mih, D. T. en_US
dc.contributor.author Gerke, R. D. en_US
dc.contributor.author Sandor, M. A. en_US
dc.date.accessioned 2004-09-23T21:15:48Z
dc.date.available 2004-09-23T21:15:48Z
dc.date.issued 2000-08-17 en_US
dc.identifier.citation 3rd Annual IEEE Microelctronics Reliability and Qualification Workshop en_US
dc.identifier.citation Glendale, California, USA en_US
dc.identifier.clearanceno 00-1732 en_US
dc.identifier.uri http://hdl.handle.net/2014/15929
dc.format.extent 49017 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other thermal cycle tests plastic encapsulated microelectronics space qualification methodology en_US
dc.title Extreme thermal environmental tests of plastic encapsulated cots en_US


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