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Interconnection and packaging isses of microelectromechanical systems (MEMS) and COTS MEMS
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| dc.contributor.author | Ramesham, R. | en_US |
| dc.contributor.author | Ghaffarian, R. | en_US |
| dc.date.accessioned | 2004-09-23T21:10:33Z | |
| dc.date.available | 2004-09-23T21:10:33Z | |
| dc.date.issued | 2000-07-25 | en_US |
| dc.identifier.citation | COTS MEMS | en_US |
| dc.identifier.citation | San Francisco, California, USA | en_US |
| dc.identifier.clearanceno | 00-1632 | en_US |
| dc.identifier.uri | http://hdl.handle.net/2014/15856 | |
| dc.description.abstract | MEMS quality and reliability challenges are discussed and needs for study in these areas are identified. | en_US |
| dc.format.extent | 1585417 bytes | |
| dc.format.mimetype | application/pdf | |
| dc.language.iso | en_US | |
| dc.subject.other | MEMS packaging interconnection failure mechanisms | en_US |
| dc.title | Interconnection and packaging isses of microelectromechanical systems (MEMS) and COTS MEMS | en_US |
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JPL TRS 1992+
JPL TRS 1992+