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Interconnection and packaging isses of microelectromechanical systems (MEMS) and COTS MEMS

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dc.contributor.author Ramesham, R. en_US
dc.contributor.author Ghaffarian, R. en_US
dc.date.accessioned 2004-09-23T21:10:33Z
dc.date.available 2004-09-23T21:10:33Z
dc.date.issued 2000-07-25 en_US
dc.identifier.citation COTS MEMS en_US
dc.identifier.citation San Francisco, California, USA en_US
dc.identifier.clearanceno 00-1632 en_US
dc.identifier.uri http://hdl.handle.net/2014/15856
dc.description.abstract MEMS quality and reliability challenges are discussed and needs for study in these areas are identified. en_US
dc.format.extent 1585417 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other MEMS packaging interconnection failure mechanisms en_US
dc.title Interconnection and packaging isses of microelectromechanical systems (MEMS) and COTS MEMS en_US


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