Reliability Challenges in Emerging IC Metallization Technologies

dc.contributor.author	Lloyd, J.	en_US
dc.date.accessioned	2004-09-23T17:46:43Z
dc.date.available	2004-09-23T17:46:43Z
dc.date.issued	2000-03-20	en_US
dc.identifier.citation	ESCCON 2000 European Space Components Conference	en_US
dc.identifier.citation	Noordwijk, Netherlands	en_US
dc.identifier.clearanceno	00-0493	en_US
dc.identifier.uri	http://hdl.handle.net/2014/14091
dc.description.abstract	Submicron metallization has been a mixed blessing.	en_US
dc.format.extent	527589 bytes
dc.format.mimetype	application/pdf
dc.language.iso	en_US
dc.subject.other	Copper Metallization Electromigration	en_US
dc.title	Reliability Challenges in Emerging IC Metallization Technologies	en_US