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Reliability Challenges in Emerging IC Metallization Technologies

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dc.contributor.author Lloyd, J. en_US
dc.date.accessioned 2004-09-23T17:46:43Z
dc.date.available 2004-09-23T17:46:43Z
dc.date.issued 2000-03-20 en_US
dc.identifier.citation ESCCON 2000 European Space Components Conference en_US
dc.identifier.citation Noordwijk, Netherlands en_US
dc.identifier.clearanceno 00-0493 en_US
dc.identifier.uri http://hdl.handle.net/2014/14091
dc.description.abstract Submicron metallization has been a mixed blessing. en_US
dc.format.extent 527589 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other Copper Metallization Electromigration en_US
dc.title Reliability Challenges in Emerging IC Metallization Technologies en_US


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