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High density microelectronics packaging roadmap for space applications

High density microelectronics packaging roadmap for space applications

Galbraith, L.
URI: http://hdl.handle.net/2014/12141
Date: 2001-02-13
Citation: 2001 Pan Pacific Microelectronics Symposium
Kauai, HI, USA

Abstract:

This roadmap introduces current technologies in use, related strategic issues and trends, and research recommendations for space applications.

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