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High density microelectronics packaging roadmap for space applications
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High density microelectronics packaging roadmap for space applications
Galbraith, L.
URI:
http://hdl.handle.net/2014/12141
Date:
2001-02-13
Citation:
2001 Pan Pacific Microelectronics Symposium
Kauai, HI, USA
Abstract:
This roadmap introduces current technologies in use, related strategic issues and trends, and research recommendations for space applications.
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JPL TRS 1992+
JPL TRS 1992+
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