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Choosing the right lead-free solder for hi-rel printed wiring assemblies

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dc.contributor.author Bonner, J. K. en_US
dc.contributor.author Castillo, L. del en_US
dc.contributor.author Mehta, A. en_US
dc.date.accessioned 2004-09-20T19:51:14Z
dc.date.available 2004-09-20T19:51:14Z
dc.date.issued 2003-05-11 en_US
dc.identifier.citation SAMPE: Society for the Advancement of Material and Process Engineering en_US
dc.identifier.citation Long Beach, CA, USA en_US
dc.identifier.clearanceno 02-3220 en_US
dc.identifier.uri http://hdl.handle.net/2014/11269
dc.description.abstract This paper presents data collected from a recent NASA project that focuses specifically on finding suitable altematives to eutectic tin-lead solders, especially in solder paste applications. en_US
dc.format.extent 4060970 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other printed wiring assembly PWA fabrication lead-free processes new manufacturing technologies en_US
dc.title Choosing the right lead-free solder for hi-rel printed wiring assemblies en_US


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