Choosing the right lead-free solder for hi-rel printed wiring assemblies

Bonner, J. K.; Castillo, L. del; Mehta, A.

dc.contributor.author	Bonner, J. K.	en_US
dc.contributor.author	Castillo, L. del	en_US
dc.contributor.author	Mehta, A.	en_US
dc.date.accessioned	2004-09-20T19:51:14Z
dc.date.available	2004-09-20T19:51:14Z
dc.date.issued	2003-05-11	en_US
dc.identifier.citation	SAMPE: Society for the Advancement of Material and Process Engineering	en_US
dc.identifier.citation	Long Beach, CA, USA	en_US
dc.identifier.clearanceno	02-3220	en_US
dc.identifier.uri	http://hdl.handle.net/2014/11269
dc.description.abstract	This paper presents data collected from a recent NASA project that focuses specifically on finding suitable altematives to eutectic tin-lead solders, especially in solder paste applications.	en_US
dc.format.extent	4060970 bytes
dc.format.mimetype	application/pdf
dc.language.iso	en_US
dc.subject.other	printed wiring assembly PWA fabrication lead-free processes new manufacturing technologies	en_US
dc.title	Choosing the right lead-free solder for hi-rel printed wiring assemblies	en_US