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1 to 10 of 61 Results
NASA Electronic Parts & Packaging (NEPP) program: contributions to MER success
Mar 28, 2004
Barnes, Charles E.; Ramesham, R.; Johnston, A.; Zulueta, P.; Ghaffarian, R.; Scheick, L.; LaBel, K.; Sampson, M., 2004, "NASA Electronic Parts & Packaging (NEPP) program: contributions to MER success", https://hdl.handle.net/2014/39122, IMAPS Advanced Technology Workshop on Military, Aerospace, and Homeland Security, Baltimore, Maryland, March 28, 2004., JPL Open Repository
No abstract provided
Visual and x-ray inspection characteristics of eutectic and lead free assemblies
Sep 1, 2003
Ghaffarian, R., 2003, "Visual and x-ray inspection characteristics of eutectic and lead free assemblies", https://hdl.handle.net/2014/38117, SMTA (Sufrace Mount Technology Association), Chicago, IL, September 22-26, 2003, JPL Open Repository
For high reliability applications, visual inspection has been the key technique for most conventional electronic package assemblies. Now, the use of x-ray technique has become an additional inspection requirement for quality control and detection of unique defects due to manufact...
Comparison of x-ray inspection systems for BGA/CCGA quality assurance and crack detection
Mar 31, 2003
Ghaffarian, R.; Mih, D., 2003, "Comparison of x-ray inspection systems for BGA/CCGA quality assurance and crack detection", https://hdl.handle.net/2014/6339, ['APEX 2003', 'Long Beach, CA, USA'], JPL Open Repository
This paper discusses limitation of each system and provides representative inspection images for CCGA/BGA assemblies.
Lead free and lead reliability for advanced electronic assemblies
Feb 10, 2003
Ghaffarian, R., 2003, "Lead free and lead reliability for advanced electronic assemblies", https://hdl.handle.net/2014/6266, ['Commercialization of Military and Space Electronics', 'Los Angeles, CA, USA'], JPL Open Repository
No abstract provided
SIP qualification and PRA approaches
Sep 22, 2002
Ghaffarian, R.; Goetz, M., 2002, "SIP qualification and PRA approaches", https://hdl.handle.net/2014/10090, ['Surface Mount Technology Association', 'Chicago, IL, USA'], JPL Open Repository
System in a package (SIP) development is a response to an increasing demand for integration of different functions into one unit to reduce size and cost and improve functionality. Qualification of the newly developed multifunctional electronics are becoming complex at the package...
Long-life reliability of CSP assemblies with and without underfill
Sep 22, 2002
Ghaffarian, R., 2002, "Long-life reliability of CSP assemblies with and without underfill", https://hdl.handle.net/2014/9708, ['Surface Mount Technology Association', 'Chicago, IL, USA'], JPL Open Repository
The test results for numerous chip scale package assembly performed under MicrotypeBGA Consortium led by the Jet Propulsion Laboratory have been published previously.
CSP and BGA assembly reliability in a fast ramp rate thermal cycle environment
Sep 22, 2002
Ghaffarian, R.; Kim, N., 2002, "CSP and BGA assembly reliability in a fast ramp rate thermal cycle environment", https://hdl.handle.net/2014/9646, ['Surface Mount Technology Association', 'Chicago, IL, USA'], JPL Open Repository
Inspection results along with SEM and optical cross-sectional photos revealing damage and failure mechanisms will also be presented.
Optoelectronic coupler behavior
May 8, 2002
Ghaffarian, R.; Azizi, A., 2002, "Optoelectronic coupler behavior", https://hdl.handle.net/2014/12091, ['IMAPS Southern California', 'Pasadena, CA, USA'], JPL Open Repository
No abstract provided
Rapid qualification of area array package assemblies by increase of ramp rates and temperature ranges
Apr 30, 2002
Ghaffarian, R., 2002, "Rapid qualification of area array package assemblies by increase of ramp rates and temperature ranges", https://hdl.handle.net/2014/12099, ['NASA Electronic Parts and Packaging Program', 'Houston, TX, USA'], JPL Open Repository
No abstract provided
Rapid qualification of CSP assemblies by increase of ramp rates and cycling temperature ranges
Sep 1, 2001
Ghaffarian, R.; Kim, N.; Rose, D.; Hunter, B.; Devitt, K.; Long, T., 2001, "Rapid qualification of CSP assemblies by increase of ramp rates and cycling temperature ranges", https://hdl.handle.net/2014/36837, ['Surface Mount Technology Association', 'Chicago, IL, USA'], JPL Open Repository
Team members representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
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