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Document Type: Type not specified Author: Ghaffarian, R.

1 to 10 of 13 Results

Chip Scale Package Integrity Assessment by Isothermal Aging Apr 7, 1999 Ghaffarian, R., 1999, "Chip Scale Package Integrity Assessment by Isothermal Aging", https://hdl.handle.net/2014/16701, ['High Density Packaging and MEMS', 'Denver, Colorado, USA'], JPL Open Repository Many aspects of chip scale package (CSP) technology, with focus on assembly reliability characteristics, are being investigated by the JPL-led consortia. Three types of test vehicles were considered for evaluation and currently two configurations have been built to optimize attac...
Shock and Thermal Cycling Synergism Effects on Reliability of CBGA Assemblies Mar 18, 1999 Ghaffarian, R., 1999, "Shock and Thermal Cycling Synergism Effects on Reliability of CBGA Assemblies", https://hdl.handle.net/2014/18836, ['2000 IEEE Aerospace COnference', 'Big Sky, MT, USA'], JPL Open Repository Ball Grid Arrays (BGAs) are now packages of choice especially for higher I/O counts for commercial applications and are also being considered for use in military and aerospace.
A Systems Approach for Quality and Reliability of Chip Scale Package Assembly Mar 6, 1999 Ghaffarian, R., 1999, "A Systems Approach for Quality and Reliability of Chip Scale Package Assembly", https://hdl.handle.net/2014/20718, ['MTG: 1999 IEEE Aerospace Conference', 'Aspen, CO, U.S.A.'], JPL Open Repository This paper reviews many factors that affect interconnect reliability of commercial-off-the-shelf (COSTS) chip scale package (CSP) assemblies.
Assembly Reliability of BGAs and Effects of Board Finish Feb 26, 1999 Ghaffarian, R., 1999, "Assembly Reliability of BGAs and Effects of Board Finish", https://hdl.handle.net/2014/20708, ["MTG: NEPCON West '99 Conference", 'Anaheim, CA, U.S.A.'], JPL Open Repository This paper will present failure characteristics of the assemblies up to 7,000 cycles.
Chip Scale Package and Assembly Joint Reliability Feb 24, 1999 Ghaffarian, R., 1999, "Chip Scale Package and Assembly Joint Reliability", https://hdl.handle.net/2014/20709, ["MTG: NEPCON West '99", 'U.S.A.'], JPL Open Repository The popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size.
Assessment of Strengths & Weaknesses for Major IC Packages Feb 8, 1999 Ghaffarian, R., 1999, "Assessment of Strengths & Weaknesses for Major IC Packages", https://hdl.handle.net/2014/20716, ['MFG: International Workshop Electronic Components for the Commercialization of Military & Space Systems', 'L.A., CA, U.S.A.'], JPL Open Repository No abstract provided
3D Chip Scale Package (CSP) Jan 1, 1999 Ghaffarian, R., 1999, "3D Chip Scale Package (CSP)", https://hdl.handle.net/2014/17367, ['Book: Chip Scale Packaging for Modern Electronics', 'U.S.A.'], JPL Open Repository Package/die stacking technology enhances most aspects of electronic systems such as size, weight, speed, yield, and power consumption.
Reliability Issues of COTS MEMS for Aerospace Applications Jan 1, 1999 Ramesham, R.; Ghaffarian, R.; Kim, N., 1999, "Reliability Issues of COTS MEMS for Aerospace Applications", https://hdl.handle.net/2014/17737, ['Micromachining and Micro Fabrication, Proceedings of SPIE', 'Bellingham, WA, USA'], JPL Open Repository This paper reviews the current status of MEMS packaging technology from COTS to specific application provides lessons learned, and finally, identifies a need for systematic approach for this purpose.
Chip Scale Package Implementation Issues Jan 1, 1999 Ghaffarian, R., 1999, "Chip Scale Package Implementation Issues", https://hdl.handle.net/2014/17353, ['Semiconductor FabTech.', 'U.S.A.'], JPL Open Repository Availability of board solder joint reliability information is critical to the wider implementation of Chip Scale Packages (CSPs).
CSP Assembly Reliability Challenges Nov 1, 1998 Ghaffarian, R., 1998, "CSP Assembly Reliability Challenges", https://hdl.handle.net/2014/20476, ['MTG: International Wireless Communications Conference', 'San Diego, CA, U.S.A.'], JPL Open Repository This paper will compare three different CSP concepts as well as their assembly reliability.

Chip Scale Package Integrity Assessment by Isothermal Aging

Apr 7, 1999

Ghaffarian, R., 1999, "Chip Scale Package Integrity Assessment by Isothermal Aging", https://hdl.handle.net/2014/16701, ['High Density Packaging and MEMS', 'Denver, Colorado, USA'], JPL Open Repository

Many aspects of chip scale package (CSP) technology, with focus on assembly reliability characteristics, are being investigated by the JPL-led consortia. Three types of test vehicles were considered for evaluation and currently two configurations have been built to optimize attac...

Shock and Thermal Cycling Synergism Effects on Reliability of CBGA Assemblies

Mar 18, 1999

Ghaffarian, R., 1999, "Shock and Thermal Cycling Synergism Effects on Reliability of CBGA Assemblies", https://hdl.handle.net/2014/18836, ['2000 IEEE Aerospace COnference', 'Big Sky, MT, USA'], JPL Open Repository

Ball Grid Arrays (BGAs) are now packages of choice especially for higher I/O counts for commercial applications and are also being considered for use in military and aerospace.

A Systems Approach for Quality and Reliability of Chip Scale Package Assembly

Mar 6, 1999

Ghaffarian, R., 1999, "A Systems Approach for Quality and Reliability of Chip Scale Package Assembly", https://hdl.handle.net/2014/20718, ['MTG: 1999 IEEE Aerospace Conference', 'Aspen, CO, U.S.A.'], JPL Open Repository

This paper reviews many factors that affect interconnect reliability of commercial-off-the-shelf (COSTS) chip scale package (CSP) assemblies.

Assembly Reliability of BGAs and Effects of Board Finish

Feb 26, 1999

Ghaffarian, R., 1999, "Assembly Reliability of BGAs and Effects of Board Finish", https://hdl.handle.net/2014/20708, ["MTG: NEPCON West '99 Conference", 'Anaheim, CA, U.S.A.'], JPL Open Repository

This paper will present failure characteristics of the assemblies up to 7,000 cycles.

Chip Scale Package and Assembly Joint Reliability

Feb 24, 1999

Ghaffarian, R., 1999, "Chip Scale Package and Assembly Joint Reliability", https://hdl.handle.net/2014/20709, ["MTG: NEPCON West '99", 'U.S.A.'], JPL Open Repository

The popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size.

Assessment of Strengths & Weaknesses for Major IC Packages

Feb 8, 1999

Ghaffarian, R., 1999, "Assessment of Strengths & Weaknesses for Major IC Packages", https://hdl.handle.net/2014/20716, ['MFG: International Workshop Electronic Components for the Commercialization of Military & Space Systems', 'L.A., CA, U.S.A.'], JPL Open Repository

No abstract provided

3D Chip Scale Package (CSP)

Jan 1, 1999

Ghaffarian, R., 1999, "3D Chip Scale Package (CSP)", https://hdl.handle.net/2014/17367, ['Book: Chip Scale Packaging for Modern Electronics', 'U.S.A.'], JPL Open Repository

Package/die stacking technology enhances most aspects of electronic systems such as size, weight, speed, yield, and power consumption.

Reliability Issues of COTS MEMS for Aerospace Applications

Jan 1, 1999

Ramesham, R.; Ghaffarian, R.; Kim, N., 1999, "Reliability Issues of COTS MEMS for Aerospace Applications", https://hdl.handle.net/2014/17737, ['Micromachining and Micro Fabrication, Proceedings of SPIE', 'Bellingham, WA, USA'], JPL Open Repository

This paper reviews the current status of MEMS packaging technology from COTS to specific application provides lessons learned, and finally, identifies a need for systematic approach for this purpose.

Chip Scale Package Implementation Issues

Jan 1, 1999

Ghaffarian, R., 1999, "Chip Scale Package Implementation Issues", https://hdl.handle.net/2014/17353, ['Semiconductor FabTech.', 'U.S.A.'], JPL Open Repository

Availability of board solder joint reliability information is critical to the wider implementation of Chip Scale Packages (CSPs).

CSP Assembly Reliability Challenges

Nov 1, 1998

Ghaffarian, R., 1998, "CSP Assembly Reliability Challenges", https://hdl.handle.net/2014/20476, ['MTG: International Wireless Communications Conference', 'San Diego, CA, U.S.A.'], JPL Open Repository

This paper will compare three different CSP concepts as well as their assembly reliability.

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