1 to 10 of 13 Results
Apr 7, 1999
Ghaffarian, R., 1999, "Chip Scale Package Integrity Assessment by Isothermal Aging", https://hdl.handle.net/2014/16701, ['High Density Packaging and MEMS', 'Denver, Colorado, USA'], JPL Open Repository
Many aspects of chip scale package (CSP) technology, with focus on assembly reliability characteristics, are being investigated by the JPL-led consortia. Three types of test vehicles were considered for evaluation and currently two configurations have been built to optimize attac... |
Mar 18, 1999
Ghaffarian, R., 1999, "Shock and Thermal Cycling Synergism Effects on Reliability of CBGA Assemblies", https://hdl.handle.net/2014/18836, ['2000 IEEE Aerospace COnference', 'Big Sky, MT, USA'], JPL Open Repository
Ball Grid Arrays (BGAs) are now packages of choice especially for higher I/O counts for commercial applications and are also being considered for use in military and aerospace. |
Mar 6, 1999
Ghaffarian, R., 1999, "A Systems Approach for Quality and Reliability of Chip Scale Package Assembly", https://hdl.handle.net/2014/20718, ['MTG: 1999 IEEE Aerospace Conference', 'Aspen, CO, U.S.A.'], JPL Open Repository
This paper reviews many factors that affect interconnect reliability of commercial-off-the-shelf (COSTS) chip scale package (CSP) assemblies. |
Feb 26, 1999
Ghaffarian, R., 1999, "Assembly Reliability of BGAs and Effects of Board Finish", https://hdl.handle.net/2014/20708, ["MTG: NEPCON West '99 Conference", 'Anaheim, CA, U.S.A.'], JPL Open Repository
This paper will present failure characteristics of the assemblies up to 7,000 cycles. |
Feb 24, 1999
Ghaffarian, R., 1999, "Chip Scale Package and Assembly Joint Reliability", https://hdl.handle.net/2014/20709, ["MTG: NEPCON West '99", 'U.S.A.'], JPL Open Repository
The popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size. |
Feb 8, 1999
Ghaffarian, R., 1999, "Assessment of Strengths & Weaknesses for Major IC Packages", https://hdl.handle.net/2014/20716, ['MFG: International Workshop Electronic Components for the Commercialization of Military & Space Systems', 'L.A., CA, U.S.A.'], JPL Open Repository
No abstract provided |
Jan 1, 1999
Ghaffarian, R., 1999, "3D Chip Scale Package (CSP)", https://hdl.handle.net/2014/17367, ['Book: Chip Scale Packaging for Modern Electronics', 'U.S.A.'], JPL Open Repository
Package/die stacking technology enhances most aspects of electronic systems such as size, weight, speed, yield, and power consumption. |
Jan 1, 1999
Ramesham, R.; Ghaffarian, R.; Kim, N., 1999, "Reliability Issues of COTS MEMS for Aerospace Applications", https://hdl.handle.net/2014/17737, ['Micromachining and Micro Fabrication, Proceedings of SPIE', 'Bellingham, WA, USA'], JPL Open Repository
This paper reviews the current status of MEMS packaging technology from COTS to specific application provides lessons learned, and finally, identifies a need for systematic approach for this purpose. |
Jan 1, 1999
Ghaffarian, R., 1999, "Chip Scale Package Implementation Issues", https://hdl.handle.net/2014/17353, ['Semiconductor FabTech.', 'U.S.A.'], JPL Open Repository
Availability of board solder joint reliability information is critical to the wider implementation of Chip Scale Packages (CSPs). |
Nov 1, 1998
Ghaffarian, R., 1998, "CSP Assembly Reliability Challenges", https://hdl.handle.net/2014/20476, ['MTG: International Wireless Communications Conference', 'San Diego, CA, U.S.A.'], JPL Open Repository
This paper will compare three different CSP concepts as well as their assembly reliability. |