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1 to 10 of 281 Results
GPS-aided Real-Time Earthquake and Tsunami (GREAT) alert system
Dec 14, 2009
Bar-Sever, Y.; Gross, R.; Khachikyan, R.; Meyer, R.; Song, T.; Webb, F.; Blewitt, G.; Plag, H-P; Hammond, W.; Kreemer, C.; Sundstrom, J.; Hsu, V.; Hudnut, K.; Simons, M., 2009, "GPS-aided Real-Time Earthquake and Tsunami (GREAT) alert system", https://hdl.handle.net/2014/45293, 2009 Fall AGU Meeting, San Francisco, California, December 14-18, 2009, JPL Open Repository
No abstract provided
Language preservation: the language of science as a bridge to the Native American community
Dec 14, 2009
Alexander, Claudia; Martin, Melba; Grant, Gloria, 2009, "Language preservation: the language of science as a bridge to the Native American community", https://hdl.handle.net/2014/45277, 2009 Fall AGU Meeting, San Francisco, California, December 14-18, 2009, JPL Open Repository
No abstract provided
Review of the Jovian trapped particle environment models: past, present, and future
Dec 14, 2009
Jun, Insoo; Garrett, Henry; Evans, Robin, 2009, "Review of the Jovian trapped particle environment models: past, present, and future", https://hdl.handle.net/2014/45285, 2009 Fall AGU Meeting, San Francisco, California, December 14-18, 2009, JPL Open Repository
No abstract provided
ASTER: Joint NASA-METI Project
Dec 14, 2009
Abrams, Michael J., 2009, "ASTER: Joint NASA-METI Project", https://hdl.handle.net/2014/45283, 2009 Fall AGU Meeting, San Francisco, California, December 14-18, 2009, JPL Open Repository
No abstract provided
Development of global high resolution soil moisture product from the SMAP mission
Dec 14, 2009
Das, Narendra N.; Entekhabi, Dara; Njoku, Eni, 2009, "Development of global high resolution soil moisture product from the SMAP mission", https://hdl.handle.net/2014/45287, 2009 Fall AGU Meeting, San Francisco, California, December 14-18, 2009, JPL Open Repository
No abstract provided
Modeling lunar radar scattering from icy regoliths
Dec 14, 2009
Thompson, Tommy; Ustinov, Eugene; Heggy, Essam, 2009, "Modeling lunar radar scattering from icy regoliths", https://hdl.handle.net/2014/45281, 2009 Fall AGU Meeting, San Francisco, California, December 14-18, 2009, JPL Open Repository
No abstract provided
Update on high I/O area array packages and assembly reliability
Dec 8, 2009
Ghaffarian, Reza, 2009, "Update on high I/O area array packages and assembly reliability", https://hdl.handle.net/2014/44699, Microelectronics Reliability and Qualification Working Meeting, Los Angeles, California, December 8-9, 2009, JPL Open Repository
No abstract provided
One NASA PEM qualification standard : comparison of JPL and GSFC standards
Dec 1, 2009
Cooper, Mark, 2009, "One NASA PEM qualification standard : comparison of JPL and GSFC standards", https://hdl.handle.net/2014/41492, UNKNOWN, JPL Open Repository
Although use of Plastic Encapsulated Microelectronics (PEMs) in space applications is discouraged, their use is mandatory for selected applications involving the need for advanced technology and small packages. Various space systems designers and manufacturers have developed meth...
Mitigation selection and qualification recommendations for Xilinx Virtex, Virtex-II, and Virtex-4 field programmable gate arrays
Dec 1, 2009
Allen, Gregory, 2009, "Mitigation selection and qualification recommendations for Xilinx Virtex, Virtex-II, and Virtex-4 field programmable gate arrays", https://hdl.handle.net/2014/41488, UNKNOWN, JPL Open Repository
This work discusses mitigation selection and qualification techniques for Xilinx reconfigurable field programmable gate arrays (FPGAs). The aim of the paper is to provide readers with a better understanding of the engineering/reliability/project cost relationship that occurs when...
Reliability of carbon core laminate Construction in printed circuit boards utilizing stablcorTM
Dec 1, 2009
Schatzel, Donald, 2009, "Reliability of carbon core laminate Construction in printed circuit boards utilizing stablcorTM", https://hdl.handle.net/2014/41686, UNKNOWN, JPL Open Repository
There is a trend continuing in the electronics industry where high reliability electronic packages are using standard epoxy glass and polyimide substrates over ceramic-based substrates. This is a result of improved fabrication accuracy and consistent raw material properties. Incr...
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