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Assembly Reliability of BGAs and Effects of Board Finish
Feb 26, 1999
Ghaffarian, R., 1999, "Assembly Reliability of BGAs and Effects of Board Finish", https://hdl.handle.net/2014/20708, ["MTG: NEPCON West '99 Conference", 'Anaheim, CA, U.S.A.'], JPL Open Repository
This paper will present failure characteristics of the assemblies up to 7,000 cycles.
Chip Scale Package and Assembly Joint Reliability
Feb 24, 1999
Ghaffarian, R., 1999, "Chip Scale Package and Assembly Joint Reliability", https://hdl.handle.net/2014/20709, ["MTG: NEPCON West '99", 'U.S.A.'], JPL Open Repository
The popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size.
Assessment of Strengths & Weaknesses for Major IC Packages
Feb 8, 1999
Ghaffarian, R., 1999, "Assessment of Strengths & Weaknesses for Major IC Packages", https://hdl.handle.net/2014/20716, ['MFG: International Workshop Electronic Components for the Commercialization of Military & Space Systems', 'L.A., CA, U.S.A.'], JPL Open Repository
No abstract provided
Chip Scale Package Implementation Issues
Jan 1, 1999
Ghaffarian, R., 1999, "Chip Scale Package Implementation Issues", https://hdl.handle.net/2014/17353, ['Semiconductor FabTech.', 'U.S.A.'], JPL Open Repository
Availability of board solder joint reliability information is critical to the wider implementation of Chip Scale Packages (CSPs).
CSP Assembly Reliability Challenges
Nov 1, 1998
Ghaffarian, R., 1998, "CSP Assembly Reliability Challenges", https://hdl.handle.net/2014/20476, ['MTG: International Wireless Communications Conference', 'San Diego, CA, U.S.A.'], JPL Open Repository
This paper will compare three different CSP concepts as well as their assembly reliability.
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