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Reliability and paste process optimization of eutectic and lead-free for mixed packaging

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dc.contributor.author Ramkumar, S. M. en_US
dc.contributor.author Ganeshan, V. en_US
dc.contributor.author Thenalur, K. en_US
dc.contributor.author Ghaffarian, R. en_US
dc.date.accessioned 2004-09-17T07:27:12Z
dc.date.available 2004-09-17T07:27:12Z
dc.date.issued 2002-09-22 en_US
dc.identifier.citation Surface Mount Technology Association en_US
dc.identifier.citation Chicago, IL, USA en_US
dc.identifier.clearanceno 02-1957 en_US
dc.identifier.uri http://hdl.handle.net/2014/9802
dc.description.abstract This paper reports the results of an experiment that utilized the JPL's area array consortium test vehicle design, containing a myriad of mixed technology components with an OSP finish. The details of the reliability study are presented in this paper. en_US
dc.format.extent 3052521 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other solder DOE ball grid array chip scale package BGA CSP eutectic leadfree reliability AAR SMT en_US
dc.title Reliability and paste process optimization of eutectic and lead-free for mixed packaging en_US


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