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Long-life reliability of CSP assemblies with and without underfill

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dc.contributor.author Ghaffarian, R. en_US
dc.date.accessioned 2004-09-17T07:08:51Z
dc.date.available 2004-09-17T07:08:51Z
dc.date.issued 2002-09-22 en_US
dc.identifier.citation Surface Mount Technology Association en_US
dc.identifier.citation Chicago, IL, USA en_US
dc.identifier.clearanceno 02-1874 en_US
dc.identifier.uri http://hdl.handle.net/2014/9708
dc.description.abstract The test results for numerous chip scale package assembly performed under MicrotypeBGA Consortium led by the Jet Propulsion Laboratory have been published previously. en_US
dc.format.extent 2638801 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other solder joint reliability thermal cycle accelerated test ball grid array chip scale package FPBGA FCBGA en_US
dc.title Long-life reliability of CSP assemblies with and without underfill en_US


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