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Chemical stability enhancement of lithium conducting solid electrolyte plates using sputtered LiPON thin film

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dc.contributor.author West, W. C. en_US
dc.contributor.author Whitacre, J. F. en_US
dc.contributor.author Lim, J. R. en_US
dc.date.accessioned 2004-09-16T23:22:45Z
dc.date.available 2004-09-16T23:22:45Z
dc.date.issued 2004-02 en_US
dc.identifier.citation Journal of power sources, vol. 126, no. 1-2, pp. 134-138 en_US
dc.identifier.clearanceno 03-1900 en_US
dc.identifier.uri http://hdl.handle.net/2014/7696
dc.description.abstract Sputter deposition of LiPON films directly onto high Li+ conductivity solid electrolyte plates has been investigated as a means to minimize the reactivity of the plates to metallic Li. The LiPON films were shown to effectively passivate the plates in contact with metallic Li, in contrast to unpassivated plates that reacted immediately in contact with Li metal. en_US
dc.format.extent 321056 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other LiPON lithium metals electrolyte plates en_US
dc.title Chemical stability enhancement of lithium conducting solid electrolyte plates using sputtered LiPON thin film en_US


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