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Qualification and reliability testing of a microchip laser system for space applications

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dc.contributor.author Wright, M. W. en_US
dc.contributor.author Franzen, D. en_US
dc.contributor.author Hemmati, H. en_US
dc.contributor.author Sandor, M. en_US
dc.date.accessioned 2004-09-16T22:22:19Z
dc.date.available 2004-09-16T22:22:19Z
dc.date.issued 2003-07-07 en_US
dc.identifier.citation Electronic Packaging Technical Conference - InterPACK03 en_US
dc.identifier.citation Maui, HI, USA en_US
dc.identifier.clearanceno 03-0904 en_US
dc.identifier.uri http://hdl.handle.net/2014/7223
dc.description.abstract This paper discusses the process being used and the results of the selection and qualification of a low cost prepackaged diode laser with a custom packaged microchip laser crystal. en_US
dc.format.extent 3187038 bytes
dc.format.mimetype application/pdf
dc.language.iso en_US
dc.subject.other laser qualification reliability en_US
dc.title Qualification and reliability testing of a microchip laser system for space applications en_US


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