Waters, Joe W.; Froidevaux, Lucien; Harwood, Robert S.; Jarnot, Robert F.; Pickett, Herbert M.; Read, William G.; Siegel, Peter H.; Cofield, Richard E.; Filipiak, Mark J.; Flower, Dennis A.; Holden, James R.; Lau, Gary K.; Livesey, Nathaniel J.; Manney, Gloria L; Pumphrey, Hugh C.; Santee, Michelle L.; Wu, Dong L.; Cuddy, David T.; Lay, Richard R.; Loo, Mario S.; Perun, Vincent S.; Schwartz, Michael J.; Stek, Paul C.; Thurstans, Robert P.; Boyles, Mark A.; Chandra, Kumar M.; Chavez, Marco C.; Chen, Gun-Shing; Chudasama, Bharat V.; Dodge, Randy; Fuller, Ryan A.; Girard, Michael A.; Jiang, Jonathan H.; Jiang, Yibo; Knosp, Brian W.; LaBelle, Remi C.; Lam, Jonathan C.; Lee, Karen A.; Miller, Dominick; Oswald, John E.; Patel, Navnit C.; Pukala, David M.; Quintero, Ofelia; Scaff, David M.; Van Snyder, W.; Tope, Michael C.; Wagner, Paul A.; Walch, Marc J.
(IEEE, 2006-05-06)