dc.contributor.author |
Ross, Ryan |
|
dc.date.accessioned |
2022-01-26T19:51:13Z |
|
dc.date.available |
2022-01-26T19:51:13Z |
|
dc.date.issued |
2020-12-07 |
|
dc.identifier.citation |
VIRTUAL EDFAS 2020, Pasadena, California, December 7-9, 2020 |
|
dc.identifier.clearanceno |
CL#20-6213 |
|
dc.identifier.uri |
http://hdl.handle.net/2014/53426 |
|
dc.description.sponsorship |
NASA/JPL |
en_US |
dc.language.iso |
en_US |
|
dc.publisher |
Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2020 |
|
dc.title |
3D Packaging and MEMS Panel Discussion |
|
dc.type |
Presentation |
|