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An Embedded Planar-Foil Capacitor Material, FPGA Based Interposer, Aimed at Improving System Performance and Reduce Board Size for Space Based Electronics

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dc.contributor.author Hunter, Don
dc.contributor.author Bolotin, Gary
dc.contributor.author Lias, Malcolm
dc.contributor.author Cheng, Ben
dc.date.accessioned 2021-11-30T21:02:51Z
dc.date.available 2021-11-30T21:02:51Z
dc.date.issued 2020-03-02
dc.identifier.citation 16th International Conference and Exhibition on Device Packaging: IMAPS DPC, Fountain Hills, Arizona, March 2-5, 2020
dc.identifier.clearanceno CL#20-1282
dc.identifier.uri http://hdl.handle.net/2014/52663
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US
dc.publisher Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2020
dc.title An Embedded Planar-Foil Capacitor Material, FPGA Based Interposer, Aimed at Improving System Performance and Reduce Board Size for Space Based Electronics
dc.type Presentation


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