An Embedded Planar-Foil Capacitor Material, FPGA Based Interposer, Aimed at Improving System Performance and Reduce Board Size for Space Based Electronics

Hunter, Don; Bolotin, Gary; Lias, Malcolm; Cheng, Ben

dc.contributor.author	Hunter, Don
dc.contributor.author	Bolotin, Gary
dc.contributor.author	Lias, Malcolm
dc.contributor.author	Cheng, Ben
dc.date.accessioned	2021-11-30T21:02:51Z
dc.date.available	2021-11-30T21:02:51Z
dc.date.issued	2020-03-02
dc.identifier.citation	16th International Conference and Exhibition on Device Packaging: IMAPS DPC, Fountain Hills, Arizona, March 2-5, 2020
dc.identifier.clearanceno	CL#20-1282
dc.identifier.uri	http://hdl.handle.net/2014/52663
dc.description.sponsorship	NASA/JPL	en_US
dc.language.iso	en_US
dc.publisher	Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2020
dc.title	An Embedded Planar-Foil Capacitor Material, FPGA Based Interposer, Aimed at Improving System Performance and Reduce Board Size for Space Based Electronics
dc.type	Presentation