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An Embedded Planar-Foil Capacitor Material, FPGA Based Interposer, Aimed at Improving System Performance and Reduce Board Size for Space Based Electronics

An Embedded Planar-Foil Capacitor Material, FPGA Based Interposer, Aimed at Improving System Performance and Reduce Board Size for Space Based Electronics

Hunter, Don; Bolotin, Gary; Lias, Malcolm; Cheng, Ben
URI: http://hdl.handle.net/2014/52663
Date: 2020-03-02
Publisher: Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2020
Citation: 16th International Conference and Exhibition on Device Packaging: IMAPS DPC, Fountain Hills, Arizona, March 2-5, 2020

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