Abstract:
This paper presents our work to date in developing, and testing an embedded planar-foil capacitor based interposer intended to be integrated together with high-density components such as Field Programmable Gate Arrays (FPGAs), and Application Specific Integrated Circuit (ASIC) applications. FPGA devices typically have a large number of I/O and power pins. The high speed enabled by these devices requires a large number of discrete bypass capacitors as close as possible to the power pins. These capacitors take up a considerable amount of the board area on the application circuit board. Our interposer replaces these components freeing up space of traditional bypass capacitors for other circuitry. Our Interposer focuses on the needs of Micro Semi’s RTG4 FPGA. We developed the interposer using COTS embedded foil capacitors. The Interposer is customized to the capacitance requirements for each of the FPGA banks. We evaluated three foil manufactures Oak Mitsui, 3M and TDK. The three different designs were evaluated, but we will focus on the Oak-Mitsui based Interposer that we constructed and tested. Through simulations, we validate the horizontal and vertical interconnect inductances, that FPGA decoupling requirements are met. The use of the interposer results in an overall reduction in our Printed Wiring Board (PWB) area.
