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Packaging and Integration Solutions at Terahertz Frequencies

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dc.contributor.author Chattopadhyay, Goutam
dc.date.accessioned 2021-06-02T23:36:14Z
dc.date.available 2021-06-02T23:36:14Z
dc.date.issued 2019-09-29
dc.identifier.citation European Microwave Week 2019, Paris, France, September 29-October 4, 2019 en_US
dc.identifier.clearanceno 19-5229
dc.identifier.uri http://hdl.handle.net/2014/52219
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2019 en_US
dc.title Packaging and Integration Solutions at Terahertz Frequencies en_US
dc.type Presentation en_US


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