An embedded planar-foil capacitor material, FPGA based interposer, aimed at improving system performance and reduced board size for space based electronics

Abstract

This paper presents work to date in developing, and testing an embedded planar-foil capacitor based interposer intended to be integrated together with high-density components such as Field Programmable Gate Arrays (FPGAs), and Application Specific Integrated Circuits (ASIC). FPGA devices typically have a large number of I/O and power pins. The high speed enabled by these devices requires a large number of discrete bypass capacitors as close as possible to the power pins. These capacitors take up a considerable amount of the board area on the application circuit board. The developed interposer replaces these components freeing up space of traditional bypass capacitors for other circuitry.