An embedded planar-foil capacitor material, FPGA based interposer, aimed at improving system performance and reduced board size for space based electronics
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An embedded planar-foil capacitor material, FPGA based interposer, aimed at improving system performance and reduced board size for space based electronics
Hunter, Don J.; Bolotin, Gary S.; Lias, Malcolm L.; Cheng, Ben
Publisher:Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2020
Citation:16th International Conference and Exhibition on Device Packaging, Fountain Hills, Arizona, March 2-5, 2020
Abstract:
This paper presents work to date in developing, and testing an embedded planar-foil capacitor based interposer intended to be integrated together with high-density components such as Field Programmable Gate Arrays (FPGAs), and Application Specific Integrated Circuits (ASIC). FPGA devices typically have a large number of I/O and power pins. The high speed enabled by these devices requires a large number of discrete bypass capacitors as close as possible to the power pins. These capacitors take up a considerable amount of the board area on the application circuit board. The developed interposer replaces these components freeing up space of traditional bypass capacitors for other circuitry.