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Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) package trends and reliability

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dc.contributor.author Ghaffarian, Reza
dc.date.accessioned 2016-02-09T22:05:28Z
dc.date.available 2016-02-09T22:05:28Z
dc.date.issued 2014-10-01
dc.identifier.citation Pasadena, California, October 1, 2014 en_US
dc.identifier.uri http://hdl.handle.net/2014/45473
dc.description.abstract Bottom terminated components and quad flat no-lead (BTC/QFN) packages have been extensively used by commercial industry for more than a decade. Cost and performance advantages and the closeness of the packages to the boards make them especially unique for radio frequency (RF) applications. A number of high-reliability parts are now available in this style of package configuration. This report presents a summary of literature surveyed and provides a body of knowledge (BOK) gathered on the status of BTC/QFN and their advanced versions of multi-row QFN (MRQFN) packaging technologies. The report provides a comprehensive review of packaging trends and specifications on design, assembly, and reliability. Emphasis is placed on assembly reliability and associated key design and process parameters because they show lower life than standard leaded package assembly under thermal cycling exposures. Inspection of hidden solder joints for assuring quality is challenging and is similar to ball grid arrays (BGAs). Understanding the key BTC/QFN technology trends, applications, processing parameters, workmanship defects, and reliability behavior is important when judicially selecting and narrowing the follow-on packages for evaluation and testing, as well as for the low risk insertion in high-reliability applications. en_US
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2014 en_US
dc.relation.ispartofseries JPL Pub 14-17 en_US
dc.subject bottom termination component en_US
dc.subject solder joint reliability en_US
dc.subject MLF en_US
dc.subject IPC 7093 en_US
dc.title Body of Knowledge (BOK) for Leadless Quad Flat No-Lead/Bottom Termination Components (QFN/BTC) package trends and reliability en_US
dc.type Technical Report en_US
dc.subject.NASATaxonomy Engineering-Quality Assurance and Reliability Physics en_US


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