Area array package trends and assembly reliability/failures for tin-lead and lead-free solder

Ghaffarian, Reza

dc.contributor.author	Ghaffarian, Reza
dc.date.accessioned	2014-09-05T21:04:25Z
dc.date.available	2014-09-05T21:04:25Z
dc.date.issued	2010-02-06
dc.identifier.citation	Components for Military and Space Electronics Conference (CMSE), Los Angeles, California, February 6-9, 2010	en_US
dc.identifier.clearanceno	09-4958
dc.identifier.uri	http://hdl.handle.net/2014/44700
dc.description.sponsorship	NASA/JPL	en_US
dc.language.iso	en_US	en_US
dc.publisher	Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2010	en_US
dc.subject	BGA	en_US
dc.subject	CGA	en_US
dc.subject	PBGA	en_US
dc.subject	column grid array	en_US
dc.subject	thermal cycles	en_US
dc.subject	drop	en_US
dc.title	Area array package trends and assembly reliability/failures for tin-lead and lead-free solder	en_US
dc.type	Presentation	en_US