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Area array package trends and assembly reliability/failures for tin-lead and lead-free solder

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dc.contributor.author Ghaffarian, Reza
dc.date.accessioned 2014-09-05T21:04:25Z
dc.date.available 2014-09-05T21:04:25Z
dc.date.issued 2010-02-06
dc.identifier.citation Components for Military and Space Electronics Conference (CMSE), Los Angeles, California, February 6-9, 2010 en_US
dc.identifier.clearanceno 09-4958
dc.identifier.uri http://hdl.handle.net/2014/44700
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2010 en_US
dc.subject BGA en_US
dc.subject CGA en_US
dc.subject PBGA en_US
dc.subject column grid array en_US
dc.subject thermal cycles en_US
dc.subject drop en_US
dc.title Area array package trends and assembly reliability/failures for tin-lead and lead-free solder en_US
dc.type Presentation en_US


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