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Area array package trends and assembly reliability/failures for tin-lead and lead-free solder

Area array package trends and assembly reliability/failures for tin-lead and lead-free solder

Ghaffarian, Reza
URI: http://hdl.handle.net/2014/44700
Date: 2010-02-06
Keywords: BGA; CGA; PBGA; column grid array; thermal cycles; drop
Publisher: Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2010
Citation: Components for Military and Space Electronics Conference (CMSE), Los Angeles, California, February 6-9, 2010

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