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Area array package trends and assembly reliability/failures for tin-lead and lead-free solder
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Area array package trends and assembly reliability/failures for tin-lead and lead-free solder
Ghaffarian, Reza
URI:
http://hdl.handle.net/2014/44700
Date:
2010-02-06
Keywords:
BGA; CGA; PBGA; column grid array; thermal cycles; drop
Publisher:
Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2010
Citation:
Components for Military and Space Electronics Conference (CMSE), Los Angeles, California, February 6-9, 2010
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09-4958_A1b.pdf
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JPL TRS 1992+
JPL TRS 1992+
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