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High-throughput top-down and bottom-up processes for forming single-nanotube based architectures for 3D electronics

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dc.contributor.author Kaul, Anupama B.
dc.contributor.author Megerian, Krikor G.
dc.contributor.author von Allmen, Paul
dc.contributor.author Kowalczyk, Robert
dc.contributor.author Baron, Richard
dc.date.accessioned 2013-09-09T15:43:49Z
dc.date.available 2013-09-09T15:43:49Z
dc.date.issued 2009-04-15
dc.identifier.citation Materials Research Society, San Francisco, California, April 15, 2009 en_US
dc.identifier.clearanceno 11-4127
dc.identifier.uri http://hdl.handle.net/2014/43659
dc.description.abstract We have developed manufacturable approaches to form single, vertically aligned carbon nanotubes, where the tubes are centered precisely, and placed within a few hundred nm of 1-1.5 µm deep trenches. These wafer-scale approaches were enabled by chemically amplified resists and inductively coupled Cryo-etchers for forming the 3D nanoscale architectures. The tube growth was performed using dc plasma-enhanced chemical vapor deposition (PECVD), and the materials used for the pre-fabricated 3D architectures were chemically and structurally compatible with the high temperature (700 ºC) PECVD synthesis of our tubes, in an ammonia and acetylene ambient. Tube characteristics were also engineered to some extent, by adjusting growth parameters, such as Ni catalyst thickness, pressure and plasma power during growth. Such scalable, high throughput top-down fabrication techniques, combined with bottom-up tube synthesis, should accelerate the development of PECVD tubes for applications such as interconnects, nano-electromechanical (NEMS), sensors or 3D electronics in general. en_US
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2011. en_US
dc.subject top dpwn fabrication en_US
dc.subject nanofabrication en_US
dc.subject plasma-enhanced chemical vapor deposition (PECVD), en_US
dc.subject 3D electronics en_US
dc.title High-throughput top-down and bottom-up processes for forming single-nanotube based architectures for 3D electronics en_US
dc.type Preprint en_US


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