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Qualification of bonding process of temperature sensors to extreme temperature Deep Space Missions

Show simple item record Ramesham, Rajeshuni Kitiyakara, Amarit Redick, Richard Sunada, Eric T. 2013-08-07T20:02:16Z 2013-08-07T20:02:16Z 2011-01-24
dc.identifier.citation Small Body Assessment Group, Washington, D. C., January 24, 2011. en_US
dc.identifier.clearanceno 11-0465
dc.description.abstract A process has been explored based on the state-of-the-art technology to bond the platinum resistance thermometer (PRT) on to potential aerospace material such as a flat aluminum surface and a flexible copper tube to simulate coaxial cable for the flight applications. Primarily, PRTs were inserted into a metal plated copper braid to avoid stresses on the sensor while attaching the sensor with braid to the base material for long duration deep space missions. Appropriate pretreatment has been implemented in this study to enhance the adhesion of the PRTs to the base material. NuSil product has been chosen in this research to attach PRT to the base materials. The resistance (~1.1 kΩ) of PRTs has been electrically monitored continuously during the qualification thermal cycling testing from -150ᵒC to +120ᵒC and -100ᵒC to -35ᵒC. The test hardware has been thermal cycled three times the mission life per JPL design principles for JUNO project. No PRT failures were observed during and after the PRT thermal cycling qualification test for extreme temperature environments. However, there were some failures associated with staking of the PRT pig tails as a result of thermal cycling qualification test. en_US
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2011. en_US
dc.subject Extreme temperatures en_US
dc.subject bonding process qualification en_US
dc.subject platinum resistance thermometer (PRT) reliability en_US
dc.subject bonding materials en_US
dc.subject staking en_US
dc.subject platinum resistance thermometer (PRT) failures en_US
dc.subject installation failures en_US
dc.title Qualification of bonding process of temperature sensors to extreme temperature Deep Space Missions en_US
dc.type Preprint en_US

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