Physics of failure analysis of Xilinx Flip Chip CCGA packages: effects of mission environments on properties of LP2 underfill and ATI lid adhesive materials

Suh, Jong-ook

dc.contributor.author	Suh, Jong-ook
dc.date.accessioned	2013-05-10T17:59:17Z
dc.date.available	2013-05-10T17:59:17Z
dc.date.issued	2013-04
dc.identifier.uri	http://hdl.handle.net/2014/43137
dc.description.abstract	The Xilinx Virtex 4QV and 5QV (V4 and V5) are next-generation field-programmable gate arrays (FPGAs) for space applications. However, there have been concerns within the space community regarding the non-hermeticity of V4/V5 packages; polymeric materials such as the underfill and lid adhesive will be directly exposed to the space environment. In this study, reliability concerns associated with the non-hermeticity of V4/V5 packages were investigated by studying properties and behavior of the underfill and the lid adhesvie materials used in V4/V5 packages.	en_US
dc.description.sponsorship	NASA/JPL	en_US
dc.language.iso	en_US	en_US
dc.publisher	Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2013.	en_US
dc.relation.ispartofseries	JPL Publication	en_US
dc.relation.ispartofseries	13-8	en_US
dc.subject	Virtex-4	en_US
dc.subject	Virtex-5	en_US
dc.subject	Class-Y	en_US
dc.subject	underfill	en_US
dc.subject	lid adhesive	en_US
dc.subject	non-hermeticity	en_US
dc.title	Physics of failure analysis of Xilinx Flip Chip CCGA packages: effects of mission environments on properties of LP2 underfill and ATI lid adhesive materials	en_US
dc.type	Technical Report	en_US
dc.subject.NASATaxonomy	Quality Assurance and Reliability	en_US