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Physics of failure analysis of Xilinx Flip Chip CCGA packages: effects of mission environments on properties of LP2 underfill and ATI lid adhesive materials

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dc.contributor.author Suh, Jong-ook
dc.date.accessioned 2013-05-10T17:59:17Z
dc.date.available 2013-05-10T17:59:17Z
dc.date.issued 2013-04
dc.identifier.uri http://hdl.handle.net/2014/43137
dc.description.abstract The Xilinx Virtex 4QV and 5QV (V4 and V5) are next-generation field-programmable gate arrays (FPGAs) for space applications. However, there have been concerns within the space community regarding the non-hermeticity of V4/V5 packages; polymeric materials such as the underfill and lid adhesive will be directly exposed to the space environment. In this study, reliability concerns associated with the non-hermeticity of V4/V5 packages were investigated by studying properties and behavior of the underfill and the lid adhesvie materials used in V4/V5 packages. en_US
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2013. en_US
dc.relation.ispartofseries JPL Publication en_US
dc.relation.ispartofseries 13-8 en_US
dc.subject Virtex-4 en_US
dc.subject Virtex-5 en_US
dc.subject Class-Y en_US
dc.subject underfill en_US
dc.subject lid adhesive en_US
dc.subject non-hermeticity en_US
dc.title Physics of failure analysis of Xilinx Flip Chip CCGA packages: effects of mission environments on properties of LP2 underfill and ATI lid adhesive materials en_US
dc.type Technical Report en_US
dc.subject.NASATaxonomy Quality Assurance and Reliability en_US


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