dc.contributor.author |
Agarwal, Shri |
|
dc.date.accessioned |
2013-02-07T23:00:06Z |
|
dc.date.available |
2013-02-07T23:00:06Z |
|
dc.date.issued |
2012-01-18 |
|
dc.identifier.citation |
IMAPS leads the Microelectronics Packaging Society, Orlando, Florida, January 18, 2012. |
en_US |
dc.identifier.clearanceno |
12-0092 |
|
dc.identifier.uri |
http://hdl.handle.net/2014/42725 |
|
dc.description.sponsorship |
NASA/JPL |
en_US |
dc.language.iso |
en_US |
en_US |
dc.publisher |
Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012. |
en_US |
dc.subject |
Class Y |
en_US |
dc.subject |
G12 |
en_US |
dc.subject |
Engineering Practice (EP) study |
en_US |
dc.subject |
solder columns |
en_US |
dc.title |
Yearly Progress Update On the Class Y Initiative |
en_US |
dc.type |
Presentation |
en_US |
dc.subject.NASATaxonomy |
Electronics and Electrical Engineering |
en_US |