Yearly Progress Update On the Class Y Initiative

Agarwal, Shri

dc.contributor.author	Agarwal, Shri
dc.date.accessioned	2013-02-07T23:00:06Z
dc.date.available	2013-02-07T23:00:06Z
dc.date.issued	2012-01-18
dc.identifier.citation	IMAPS leads the Microelectronics Packaging Society, Orlando, Florida, January 18, 2012.	en_US
dc.identifier.clearanceno	12-0092
dc.identifier.uri	http://hdl.handle.net/2014/42725
dc.description.sponsorship	NASA/JPL	en_US
dc.language.iso	en_US	en_US
dc.publisher	Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012.	en_US
dc.subject	Class Y	en_US
dc.subject	G12	en_US
dc.subject	Engineering Practice (EP) study	en_US
dc.subject	solder columns	en_US
dc.title	Yearly Progress Update On the Class Y Initiative	en_US
dc.type	Presentation	en_US
dc.subject.NASATaxonomy	Electronics and Electrical Engineering	en_US