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Yearly Progress Update On the Class Y Initiative

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dc.contributor.author Agarwal, Shri
dc.date.accessioned 2013-02-07T23:00:06Z
dc.date.available 2013-02-07T23:00:06Z
dc.date.issued 2012-01-18
dc.identifier.citation IMAPS leads the Microelectronics Packaging Society, Orlando, Florida, January 18, 2012. en_US
dc.identifier.clearanceno 12-0092
dc.identifier.uri http://hdl.handle.net/2014/42725
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012. en_US
dc.subject Class Y en_US
dc.subject G12 en_US
dc.subject Engineering Practice (EP) study en_US
dc.subject solder columns en_US
dc.title Yearly Progress Update On the Class Y Initiative en_US
dc.type Presentation en_US
dc.subject.NASATaxonomy Electronics and Electrical Engineering en_US


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