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Reliability of high I/O high density CCGA interconnect electronic packages under extreme thermal environments

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dc.contributor.author Ramesham, Rajeshuni
dc.date.accessioned 2013-02-07T21:27:37Z
dc.date.available 2013-02-07T21:27:37Z
dc.date.issued 2012-01-22
dc.identifier.citation SPIE Photonics West, San Francisco, California, January 21-26, 2012 en_US
dc.identifier.clearanceno 12-2282
dc.identifier.uri http://hdl.handle.net/2014/42706
dc.description.abstract This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. en_US
dc.description.sponsorship NASA/JPL en_US
dc.language.iso en_US en_US
dc.publisher Pasadena, CA : Jet Propulsion Laboratory, National Aeronautics and Space Administration, 2012. en_US
dc.subject extreme temperatures en_US
dc.subject high density CCGA qualifications en_US
dc.subject CCGA reliabiilty en_US
dc.subject solder joint failures en_US
dc.subject optical inspections en_US
dc.title Reliability of high I/O high density CCGA interconnect electronic packages under extreme thermal environments en_US
dc.type Preprint en_US
dc.subject.NASATaxonomy Spacecraft Design, Testing and Performance en_US


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